Microelectronics Manufacturing Technology

Process Capability




Number of layers: 1-4




Plate thickness: 0.1mm-0.6mm




Minimum line width/spacing: 3.0 mils




Minimum mechanical drilling hole diameter: 0.25mm




Impedance tolerance (Ω): ± 3 (<30) ± 10% (≥ 30)




Surface treatment processes: lead spray tin, chemical gold precipitation, chemical nickel palladium gold precipitation, tin precipitation, silver precipitation, full plate gold plating, organic coating treatment, lead free tin spraying, hard gold plating, soft gold plating, gold fingers, etc




Conventional material: FR-4, BT resin




Special materials: halogen free, high-frequency (Rogers, DuPont), etc




[Production capacity]




Batch size: 150 million square meters/month




Sample: 50-80 models/day




Shipment: sample 1 - 5 days, batch size: 8 - 20 days

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